Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology The Cadence Integrity ™ 3D-IC Platform now features enhanced support for improved ...

Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the plumbing that feeds them data. A new generation of 3D chips, built by stacking ...

Researchers used 3D printing and capillary action to create customizable neural chips, expanding design freedom for brain research, biosensors and biocomputing. (Nanowerk News) Cultured neural tissues ...

Researchers at Stanford, MIT, and other universities unveiled a new, monolithic 3D processor that could help solve one of the biggest problems facing chipmakers: the processor-memory performance gap.

A chip smaller than one square millimeter stores 160 holographic images at arbitrary 3D coordinates, with each spatial ...

As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...

The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...

2D NOR flash challenges. Why do we need 3D NOR flash memory? What are the challenges in designing 3D NOR memory? NOR flash memory has been a mainstay for microcontrollers and microprocessors for code ...

Lam Research is poised for long-term growth due to the increasing demand for 3D NAND, DRAM, and logic chips driven by AI adoption. Regardless of concerns over potential revenue loss from China, Lam's ...

A new chip-based quantum memory uses nanoprinted “light cages” to trap light inside atomic vapor, enabling fast, reliable ...