John Kibarian, CEO of PDF Solutions, talks with Semiconductor Engineering’s Ed Sperling about the growing role of AI in chip ...

3D chips and multi-die assemblies can offer significant improvements in performance and power, but the tradeoff is the increased amount of time and money it takes to generate working silicon. There ...

A new cryogenic plasma etching technique developed by Japanese researchers dramatically accelerates semiconductor fabrication while cutting environmental impact, offering a potential breakthrough for ...

This edition explores how materials science, nanofabrication, and workforce development intersect to support a resilient U.S.

Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the plumbing that feeds them data. A new generation of 3D chips, built by stacking ...

Kinex™ is the industry’s first integrated die-to-wafer hybrid bonding system; enables production of higher performance, lower power advanced logic and memory chips Xtera™ system enables higher ...

Advancements in Applied Materials Machines for Enhanced Chip Performance It’s pretty wild how much chip performance has ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

It’s a complex story, but the short answer for who makes Apple’s chips, especially their cutting-edge A-series and M-series ...

Indian-origin professors Subhasish Mitra of Stanford University and Tathagata Srimani of Carnegie Mellon University are at the centre of a breakthrough that could reshape how artificial intelligence ...

Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically speeding up how data moves inside the chip. Unlike traditional flat designs, ...