Flexible hybrid electronics (FHE) has spawned the development of novel packaging techniques to overcome the application limitations of the rigid boards, high-temperature solders, bulky component ...

Ultrasonic Additive Manufacturing (UAM) is an innovative, solid‐state process that employs high-frequency mechanical vibrations to bond layers of metal tapes or foils. Distinguished from traditional ...

Injection-molded liquid silicone rubber (LSR) is used in the manufacture of many goods, from medical devices to cookware to electronics. Many LSR applications require that the silicone be bonded to ...

After years of hype, additive manufacturing techniques that build products layer by layer are starting to become more commonplace in shop-floor production, as well as in the design office. They are ...

The AM process begins with a digital design, usually created using computer-aided design (CAD) software, which is then sliced into thin layers. Depending on the specific AM technique, material may be ...

CARY, N.C.—Parker Lord Corp. has released a new silicone additive that allows for self-bonding, without the requirement of adhesives or primers. Chemlok 3Stream can "significantly reduce the ...

Cold spray coating is a solid‐state deposition process in which fine powders are accelerated to high velocities and directed onto substrates, forming dense, adherent coatings without melting the ...

Through collaborative research, Professor Choi Jong-min’s team from the Department of Energy Science and Engineering at DGIST (President Kunwoo Lee) and Dr. Moon Byung-joon’s team from the Center for ...

VANCOUVER, Wash.--(BUSINESS WIRE)--Kyocera (Booth #428) will highlight a range of ceramic and single-crystal sapphire engineering solutions at Pittcon in Boston, Massachusetts, March 3rd-5th, 2025.