Kenji Hata (Prime Senior Researcher), the Nanotube Research Center (NTRC; Director: Sumio Iijima) of the National Institute of Advanced Industrial Science and Technology (AIST; President: Ryoji ...

Copper electrodeposition is a vital process in the fabrication of microelectronic interconnects, battery components and decorative coatings. By utilising carefully formulated electrolytes and ...

Copper plating has been extensively employed in the fabrication of embedded packaging to reach high-density, high-speed, high performance electronic products. With through holes (TH) as well as blind ...

San Jose, California – October 20, 2009 – Novellus Systems (NASDAQ: NVLS) today introduced the SABRE Excel, an advanced copper electroplating system designed to provide industry-leading fill and ...

Researchers in Japan have developed an incredibly thin wire—just half a micrometer in diameter—made from a new composite material composed of traditional copper and those new fangled carbon nanotubes.

Lithium metal exhibits great promise in terms of anode materials for the next-generation high-energy-density batteries. However, the problems with dendrite development and significant volume ...

FREMONT, Calif., March 10, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...

Electroplating intermediates refer to a class of fine chemicals used as electroplating additives. Unlike the salt used in the plating production process, the electroplating intermediate is an additive ...