New series of multi-channel power management modules for smartphones and tablets is based on SESUB technology, featuring a power supply management IC chip that is embedded directly into the substrate.

For extra-powerful, high-efficiency inverter systems in railcars, electric power systems and more Mitsubishi Electric’s SBD-embedded SiC-MOSFET modules, including the 3.3kV/800A version released on ...

TOKYO--(BUSINESS WIRE)-- Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it has developed a new structure for a silicon carbide metal-oxide-semiconductor field-effect transistor ...

Computer-on-modules (COMs), or system-on-modules (SOMs), were on full display at embedded world in Nuremberg, June 21–23. COMs, SOMs, or server-on-modules are complete embedded computers on one ...

TOKYO--(BUSINESS WIRE)--Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it has begun shipping low-current 3.3kV/400A and 3.3kV/200A versions of a Schottky barrier diode (SBD) ...

DENVER--(BUSINESS WIRE)--Advanced Energy (Nasdaq: AEIS) today announced it will introduce the highly-flexible iHP intelligent configurable power supply for the semiconductor industry across a wide ...

Power modules might be the semiconductor industry’s answer to some constant problems. With advanced component integration, optimization, and performance, modules deliver a power solution that ...

Infineon Technologies AG has released the next generation of high-density power modules, supporting AI and high-performance data-center compute. Data centers represent two percent of global energy ...

Global electricity demand is rising faster than new large power plants can be built, and the cost of that imbalance is ...

RAM Innovations, a R&D and manufacturing services provider and developer of embedded die packaging (EDP) solutions for electronics manufacturing, has been tasked with playing an essential role in a ...