Chipmakers are relying on machine learning for electroplating and wafer cleaning at leading-edge process nodes, augmenting traditional fault detection/classification and statistical process control in ...
The PROCOMP project demonstrator tank uses in-situ consolidation during automated fiber placement (AFP) of carbon fiber/LMPAEK tape and ultrasonic welding for assembly. Photo Credit: DLR CC BY-NC-ND 3 ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback