Initiatives such as the Shift2Rail European programme are encouraging research into innovative rail product solutions with the aim of doubling the capacity of the European rail system, increasing its ...
A new technical paper titled “Characterizing the Broadband RF Permittivity of 3D-Integrated Layers in a Glass Wafer Stack from 100 MHz to 30 GHz” was published by researchers at NIST. “We present a ...
This paper proposes an integrated-structure notion of interlevel (part-whole) emergence, from a dynamic relational ontological perspective. First, I will argue that only the individualist essentialism ...
With the semiconductor industry moving toward 3D DRAM, 3D logic architectures, and 1000+ layer 3D NAND stacks, 1 mechanical failures may become more common. Due to the complexity of these structures, ...
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