Ansys (ANSS) and TSMC deliver a high-fidelity multiphysics solution to address design challenges for artificial intelligence (AI), datacenter, cloud, and high-performance computing (HPC) chips The ...

COMSOL version 6.0 delivers performance improvements and simplifies simulation of many important applications, such as printed circuit board (PCB) design (pictured). COMSOL Inc. (Burlington, Mass., ...

Multiphysics simulation helps engineers understand the interaction of thermal, structural, acoustic, fluid, and electromagnetic effects in complex systems. Accurate material properties are crucial; ...

Complicated problems take longer to solve. In engineering, it’s a given that simulation drastically accelerates the development cycle, enabling engineers to digitally test ideas and optimize products ...

COMSOL, the leading provider of software solutions for multiphysics modeling has released version 6.0 of the COMSOL Multiphysics® software. The release introduces the Model Manager, a new workspace in ...

The term "multiphysics" applied to FEA software refers to the simultaneous combination of multiple physical models from different domains — such as fluid, structure, and chemical — to accurately ...

Digitally prototyping complex designs, such as large physical structures, biological features, and micro-electromechanical systems (MEMS) requires supercomputers running sophisticated multiphysics ...

Why modern electronics are so susceptible to thermomechanical fatigue. How multiphysics software tools can aid the design process, resulting in better product longevity. The airbags in your car… the ...

PITTSBURGH, April 24, 2024 /PRNewswire/ -- Ansys (NASDAQ: ANSS) today announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a ...

COMSOL Multiphysics® version 6.2 introduces game-changing functionality for simulation apps and digital twins as well as faster solver technology. Users can now increase the computational speed of ...