As semiconductor devices become more complex, so do the methods for patterning them. Ever-smaller features at each new node require continuous advancements in photolithography techniques and ...
The shift from planar devices to finFETs enables chipmakers to scale their processes and devices from 16nm/14nm and beyond, but the industry faces several challenges at each node. Cost and technical ...
2019 marked an important milestone for extreme ultraviolet (EUV) lithography. In that year, the EUV patterning technology was for the first time deployed for the mass production of logic chips of the ...
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