Today's systematic and more subtle random defects are not only decreasing yields, but are also increasing the number of test escapes, or defective parts per million (DPPM) shipped out. One of the ...
Today's chip designs are getting smaller and bigger. Feature sizes are moving into nanometer geometries, and gate counts are pushing towards the 100M gate mark. Semiconductor companies creating these ...
Design for test (DFT) has been around since the 1960s. The technology was developed to reduce the cost of creating a successful test for an IC. Scan design, fault models, and automatic test pattern ...
Chipmakers worldwide consider Automatic Test Pattern Generation (ATPG) their go-to method for achieving high test coverage in production. ATPG generates test patterns designed to detect faults in the ...
Historically, testability is an afterthought in the design process. But heightening complexity of chip designs, and especially SoCs, forces testability (and manufacturability) to take a more central ...
As semiconductor applications in automotive, data center, and high-performance computing grow increasingly mission-critical, the industry faces mounting pressure to achieve near-perfect manufacturing ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results