Texas Instruments (TI) Inc. has unveiled six new power modules that deliver benefits in power density, efficiency and thermal performance, while reducing size and electromagnetic interference (EMI).
These ultra-tiny power modules developed by Texas Instruments, which are 23% smaller than competing devices, also improve power density and efficiency. 1. New power modules built with MagPack ...
Fuji Electric has announced an agreement with Robert Bosch GmbH to collaborate on SiC power semiconductor modules for ...
Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In ...
The power semiconductor market is poised for remarkable growth in the next several years, fueled by the adoption of electric vehicles and renewable energy, but it also driving big changes in the ...
Navitas Semiconductor has announced the launch of its new SiCPAK™ power modules, which utilize innovative epoxy-resin potting technology alongside proprietary trench-assisted planar SiC MOSFET ...
Members can download this article in PDF format. Engineers have many options when designing power stages, from low-dropout (LDO) regulators to switching power supplies. The former provide low noise ...
Founded in 2020, Powertrim Technologies is a provider of back-end packaging equipment for power modules. Rooted in over 40 years of semiconductor trim and form toolmaking heritage, the company offers ...
The adoption of N-type modules around the world continues apace, with technologies including TOPCon, HJT and BC rapidly taking a dominant position due to the multiple and significant advantages of ...
This to augment efficiency and lifetime for AI data center, grid, and energy infrastructure and industrial electrification ...
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