Innovation in semiconductor design today is energized primarily by AI/ML, data centers, autonomous and electric vehicles, 5G/6G, and IoT. Recently developed 2.5 and 3D-IC silicon-based packaging ...

Today’s 3D integrated circuit (3D-IC) technology is the culmination of 40 years of research in universities and laboratories scattered across the globe. Beginning with dynamic random-access memory ...

Discontinuous Galerkin time-domain (DGTD) methods represent a significant evolution in the numerical simulation of electromagnetic phenomena. By decomposing the spatial domain into a series of ...

Electromagnetic-thermal co-simulation methods integrate the numerical assessment of electromagnetic fields with thermal analysis to predict the coupled behaviour of systems in which heat generation ...

SANTA ROSA, Calif.--(BUSINESS WIRE)--Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that delivers advanced design and validation solutions to help accelerate innovation to ...