Die attach materials form the cornerstone of reliable power electronic packaging, providing the essential bond between semiconductor devices and their substrates. Recent advances have focused on ...

Tolerating heat and helping to reduce it are both attributes that sintering offers as an alternative to soldering in power electronics applications. Doing more with less and, of course, packing more ...

VENTURA, Calif.--(BUSINESS WIRE)--Nexa3D, the ultrafast polymer 3D printing leader, announced today at Formnext, the immediate availability of its QLS 260 industrial laser sintering system as well as ...

Ultrasonic-assisted hot pressing (UAHP) has shown significant potential in enhancing both densification and mechanical ...

Innovations in alumina ceramic production techniques can increase the utilization of alumina ceramics in industrial applications. For instance, simple alumina components, such as alumina discs, can be ...

A lot of it comes down to special materials called piezoelectrics. Now, imagine being able to 3D print these materials into ...