IP companies have heralded a new age in platform-based design for years – ever since semiconductor integration capacity reached the point where entire systems could theoretically be integrated into a ...

SystemC standards group Open SystemC Initiative (OSCI) has released the SystemC TLM (transaction-level modeling) standard version 1.0. The TLM standard kit, which can be downloaded under an open ...

The Open SystemC Initiative (OSCI) has delivered its Draft SystemC Transaction-Level Modeling (TLM) 2.0 kit, containing proposed extensions to OSCI TLM application programming interface (API) ...

Transaction-level modeling – an abstracted representation of design IP above the RT level — continues to grow in importance for architectural exploration, performance analysis, building virtual ...

System-Level Design moderated a discussion about the future of SystemC with Thomas Alsop, corporate design solution expert at Intel; Ambar Sarkar, chief verification technologist at Paradigm Works; ...

First and only industry-ready kit leveraging OSCI 2.0 ensures OCP-IP kit is the most advanced and complete offering available Beaverton ORE. — April 21, 2009 — Open Core Protocol International ...

THAME, England--(BUSINESS WIRE)--The Open Virtual Platforms (OVP) initiative (www.OVPworld.org) has announced the release of a reference virtual platform of the ARM Integrator development board using ...

To allow virtual mode reuse in any SystemC environment, Carbon Design Systems announced that it has launched a TLM-2.0 solution for the AMBA protocol to enable modeling the widely adopted AMBA ...

High-level synthesis (HLS) continues to grow in favor among beleaguered system-on-a-chip (SoC) design teams. At the same time, EDA vendors continue to increase the capabilities of their tools. The ...

MOUNTAIN VIEW, Calif., Jan 12, 2010 -- Synopsys, Inc. (NASDAQ: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced the availability of ...