Semiconductor Engineering

Wafer Probe Struggles To Adapt To Multi-Die Assemblies

Delicate features, uneven surfaces, and extreme density make it difficult to manage probe force and ensure reliability.
AZOM

The Trends Shaping Semiconductor Wafer Manufacturing

In this interview, Dr. Chady Stephan, PhD, the Applied Markets Leader at PerkinElmer, talks to AZoM about the current trends shaping semiconductor wafer manufacturing. A semiconductor is a material ...
DIGITIMES

HTSI gets boost from probe cards and engineering services

Hermes Testing Solutions Inc. (HTSI), a provider of semiconductor wafer testing solutions, said demand for flexible and highly customized testing equipment is increasing as advanced process nodes ...
Nasdaq

Aehr Receives First Order for FOX(TM) Wafer Level Test and Burn-in System to be used for Gallium Nitride Semiconductor Engineering and Qualification

FREMONT, CA / ACCESSWIRE / December 14, 2023 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced it has received an initial customer ...
Nasdaq

Aehr Announces Shipment of Initial FOX-XP Wafer-Level Burn-In System for Advanced AI Processors

FREMONT, CA / ACCESS Newswire / February 28, 2025 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced it has completed shipment of its ...