Intel has revealed more details on its upcoming 3D Foveros packaging technology, which it will be using to built its next-gen Meteor Lake, Arrow Lake, and Lunar Lake CPUs of the future. The company ...

Traditional chip scaling is reaching its limits, prompting the industry to explore new advancements like 3D chip packaging. Intel has repositioned its foundry from a supportive role to a strategic ...

Intel is preparing its own chip-stacking technology to rival AMD’s "3D V-cache" tech, according to CEO Pat Gelsinger. But don’t expect Intel to take the same chip-stacking approach as AMD, which has ...

Intel has a new 3D technology to allow for 3D chip stacking, despite previous problems with this type of capability. Share on Facebook (opens in a new window) Share on X (opens in a new window) Share ...

Developers of three-dimensional rendering technology for the Web known as X3D are bracing for a standards war with Intel--a former backer of the project--just as their recently sundered collaboration ...

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