However, sTIMs cannot be used alone, they require backside metallization (BSM) on the module to establish a thermal path and adhesion between the lid, sTIM, and the module. Conventional BSM processing ...
The Electronics and Telecommunications Research Institute (ETRI) announced on the 19th that its Mobile Core Network Research Lab team has developed an 'Intelligent Service-Programmable Mobile Core ...
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COM Express Compact module based on the latest AMD Ryzenâ„¢ AI Embedded P100 processor series. SAN DIEGO, CA, UNITED STATES, January 20, 2026 /EINPresswire.com/ ...
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