The truth is that even the most optimistic vendor estimates for this would put very nascent stages of enterprise value toward ...

Near-term execution risks are rising as memory cost inflation limits CCG visibility, while acute Xeon supply constraints also ...

Western Digital’s ultimate aim is to combine HBDT and DPT into a single drive, which could deliver up to four times the ...

The days of tech giants buying up discrete chips are over. AI companies now need GPUs, CPUs, and everything in between.

The LPCAMM2 design is part of an ongoing effort to replace soldered LPDDR in mobile and ultra-thin systems with memory that is both upgradeable and space-efficient.

HPC data centers solved many of the technical challenges AI now faces: low-latency interconnects, advanced scheduling, liquid cooling, and CFD -based thermal modeling. AI data centers extend these ...

1 Xi’an Key Laboratory of Advanced Photo-Electronics Materials and Energy Conversion Device, School of Electronic Information, Xijing University, Xi’an, China 2 Beijing Chaoyang Foreign Language ...

Cell-surface proteins are critical therapeutic targets and are vital to cellular communication, signaling, and homeostasis. However, developing high-affinity probes such as aptamers against these ...

Abstract: The integration of blockchain and edge-to-end collaborative computing offers a solution to address the trust issues arising from untrusted IIoT devices. However, ensuring efficiency and ...

ORNL scientists developed RidgeAlloy, a new aluminum alloy that transforms impure auto-body scrap into strong structural materials. Credit: Shutterstock A new alloy could turn tomorrow’s vehicle scrap ...