By identifying emerging trends, gaps, and best practices, Axtria's benchmarking study enables life sciences organizations to design incentive programs aligned with market realities, motivate ...

The fourth annual Chiplet Summit, the largest conference dedicated to chiplets, today reported on its 2026 Best of Show Awards at the Santa Clara Convention Center. The winners are: ...

Feb. 19, 2026 — Siemens has won in the “Packaging: Design” category at the 2026 Chiplet Summit Best of Show Awards for its Innovator3D IC solution. The solution provides a fast, predictable ...

Cadence Design Systems, Inc. (NASDAQ:CDNS) Q4 2025 Earnings Call Transcript February 17, 2026 Cadence Design Systems, Inc.

Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.

ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip DesignCompany opens 20,000 sq ft HQ in Silicon Valley to deploy AI Agents to accelerate chip design workflows. Sandeep ...

Taiwan-based IC design firm Nuvoton said this week that price increases announced by Chinese microcontroller maker Cmsemicon ...

Entered 2026 With a Strong Commercial Momentum Expects Q1 2026 Revenue to Grow over 100% as Compared to Q1 2025 Reaffirms FY 2026 Guidance with Revenue Expected to Grow Between 50%-100% Year Over Year ...

Metal cost volatility is cited in price-increase notices as passive-component hikes spread; MLCC risk shows up first in ...

The Advanced Semiconductor R&D Center has officially broken ground at the headquarters campus of the Industrial Technology Research Institute ( ITRI) in Hsinchu. Jointly developed by Taiwan's Ministry ...

WINSTON – SALEM, NC, UNITED STATES, January 20, 2026 /EINPresswire.com/ — Triad Semiconductor, a leader in high-performance mixed-signal integrated circuits, today announced the production release of ...

The pace of innovation in advanced packaging is rewriting the rules that IC and package teams have relied on for decades.